DP06B19457TR [KYOCERA AVX]
Multilayer Organic 0806 CDMA Diplexer;
| 型号： | DP06B19457TR |
| 厂家： | 
KYOCERA AVX |
| 描述： | Multilayer Organic 0806 CDMA Diplexer CD |
| 文件： | 总4页 (文件大小：478K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM
Multilayer Organic (MLO )
0806 CDMA Diplexer
TM
MLO TECHNOLOGY
APPLICATIONS
The 0806 diplexer is a best in class low profile multilayer
Multiband applications including
WCDMA, WLAN, WiMax, GPS,
and cellular bands
organic passive device that is based on AVX’s patented
multilayer organic high density interconnect technology.
The MLOTM diplexer uses high dielectric constant and low
loss materials to realize high Q passive printed passive
elements such as inductors and capacitors in a multilayer
stack up. The MLOTM diplexers can support multiple
wireless standards such as WCDMA, CDMA, WLAN,
and GSM and are less than 0.6mm in thickness. These
components are ideally suited for band switching for dual
band systems. All diplexers are expansion matched to
FR4 thereby resulting in improved reliability over standard
Si and ceramic devices.
LAND GRID ARRAY
ADVANTAGES
• Low Insertion Loss
• Excellent Solderability
• Low Parasitics
• Low Profile
HOW TO ORDER
COMPONENT DIMENSIONS AND FUNCTIONS
Bottom View
Side View
0.254 0.05
(0.010 0.002ꢀ
0.635 0.05
(0.025 0.002ꢀ
DP 06
B
1945
7
TR
0.127 0.04
Type
Size
Design
Frequency
(MHz)
Finish
7 = Au
T = NiSn
Packaging
Tape & Reel
1.461 0.10
(0.058 0.004ꢀ
(0.005 0.002ꢀ
0.254 0.10
(0.010 0.004ꢀ
0.953 0.05
(0.038 0.002ꢀ
QUALITY INSPECTION
Finished parts are 100% tested for electrical parameters
and visual characteristics.
0.55 0.10
0.191 0.10
(0.008 0.004ꢀ
0.445 0.10
(0.018 0.004ꢀ
(0.022 0.004ꢀ
2.223 0.20
(0.088 0.008ꢀ
Unit: mm (inches)
Terminal No.
Terminal Name
Low Frequency Port
GND
High Frequency Port
GND
OPERATING TEMPERATURE
-40ºC to +85ºC
1
2
3
4
5
6
TERMINATION
Common Port
GND
Finishes available in Ni/Sn, Immersion Sn, Immersion Au
and OSP coatings which are compatible with automatic
soldering technologies which include reflow, wave
soldering, vapor phase and manual.
0806 CDMA DIPLEXER SPECIFICATIONS
PART NUMBER: DP06B1945TTR
ORIENTATION IN TAPE
TM
Specification
AVX -MLO mm (inches)
Size
2.2 x 1.5 (0.083 x 0.060)
Height
0.55 (0.021)
Volume (mm^3)
1.75
730 230 MHz
2200 500 MHz
1
2
3
6
5
4
1
2
3
6
5
4
1
2
3
6
5
4
Frequency Range (F1) (MHz)
Frequency Range (F2) (MHz)
Insertion Loss (F1, at Fc @ 25oC)
Insertion Loss (F1 at Fc) (-40 to 85ºC)
Insertion Loss (F2, at Fc @ 25ºC)
Insertion Loss (F1 at Fc ) (-40 to 85ºC)
Attenuation (F1) at (F2) (dB min)
Attenuation (F2) at (F1) (dB min)
VSWR (Input @ F1)
-0.4
- 0.55
-0.5
-0.65
-22
POWER CAPACITY
4.5W Maximum
-22
1.2
VSWR (Input @ F2)
1.6
VSWR (Lowband @ F1)
VSWR (Highband @ F2)
1.3
1.7
1
TM
Multilayer Organic (MLO )
0806 CDMA Diplexer
S PARAMETER MEASUREMENTS
INSERTION LOSS
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
0.0
-0.5
-1.0
-1.5
-2.0
-2.5
-3.0
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
Frequency (GHz)
Frequency (GHz)
Low Band Insertion Loss
High Band Insertion Loss
Frequency (GHz)
Insertion Loss (dB)
Frequency (GHz)
Insertion Loss (dB)
0.500
0.698
0.960
0.121
1.710
2.180
2.700
0.430
0.199
0.352
0.400
0.360
ATTENUATION
0
0
-10
-20
-30
-40
-50
-10
-20
-30
-40
-50
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Frequency (GHz)
Frequency (GHz)
Low Band Attenaution
High Band Attenaution
Frequency (GHz)
Attenuation (dB)
Frequency (GHz)
Attenuation (dB)
1.710
26.726
0.500
26.671
2.180
2.700
24.681
31.074
0.698
0.960
28.611
23.988
2
TM
Multilayer Organic (MLO )
0806 CDMA Diplexer
RETURN LOSS
0
0
-5
-5
-10
-15
-20
-25
-30
-10
-15
-20
-25
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Frequency (GHz)
Frequency (GHz)
Low Band Return Loss
High Band Return Loss
Frequency (GHz)
Insertion Loss (dB)
Frequency (GHz)
Insertion Loss (dB)
0.500
29.191
1.710
18.487
0.698
0.960
23.723
17.655
2.180
2.700
15.685
17.037
COMMON RETURN LOSS
ISOLATION
0
0
-5
-5
-10
-15
-20
-25
-30
-35
-40
-10
-15
-20
-25
-30
-35
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Frequency (GHz)
Frequency (GHz)
Common Port Return Loss
Isolation
Frequency (GHz)
Attenuation (dB)
Frequency (GHz)
Attenuation (dB)
0.500
32.382
0.500
26.956
0.698
0.960
27.566
19.543
0.698
0.960
28.872
24.238
1.710
2.180
23.343
17.958
1.710
2.180
35.833
26.827
2.700
16.744
2.700
29.338
3
TM
Multilayer Organic (MLO )
0806 CDMA Diplexer
AUTOMATED SMT ASSEMBLY
The following section describes the guidelines for automated
SMT assembly of MLOTM RF devices which are typically Land
Grid Array (LGA) packages or side termination SMT pacages.
Stencil thickness and aperture openings should be adjusted
according to the optimal solder volume. The following are
general recommendations for SMT mounting of MLOTM
devices onto the PCB.
Control of solder and solder paste volume is critical for
surface mount assembly of MLOTM RF devices onto the PCB.
SMT REFLOW PROFILE
Common IR or convection reflow SMT processes shall be
used for the assembly. Standard SMT reflow profiles, for
eutectic and Pb free solders, can be used to surface mount
the MLOTM devices onto the PCB. In all cases, a temperature
gradient of 3°C/sec, or less, should be maintained to prevent
warpage of the package and to ensure that all joints reflow
properly. Additional soak time and slower preheating time
may be required to improve the out-gassing of solder paste.
In addition, the reflow profile depends on the PCB density
and the type of solder paste used. Standard no-clean solder
paste is generally recommended. If another type of flux is
used, complete removal of flux residual may be necessary.
Example of a typical lead free reflow profile is shown below.
tp
Tp
Critical Zone
TL to Tp
Ramp-up
TL
tL
Ts max
Ts min
Ramp-down
ts
Preheat
25
t 25ºC to Peak
Time
Figure A. Typical Lead Free Profile and Parameters
Profile Parameter
Pb free, Convection, IR/Convection
3ºC/second max.
150ºC to 200ºC
Ramp-up rate (Tsmax to Tp
Preheat temperature (Ts min to Ts max)
Preheat time (ts)
Time above TL, 217ºC (tL)
Peak temperature (Tp)
60 – 180 seconds
60 – 120 seconds
260°C
Time within 5ºC of peak temperature (tp)
Ramp-down rate
Time 25ºC to peak temperature
10 – 20 seconds
4ºC/second max.
6 minutes max.
4
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